FEATURES
• Oxide planar chip junction
• Ultrafast recovery time
• Soft recovery characteristics
• Low switching losses, high efficiency
• High forward surge capability
• Solder dip 260 °C, 40 s
• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC

TYPICAL APPLICATIONS
For use in high voltage continuous mode power factor correctors (CCM PFC), switching mode power supplies, freewheeling diodes and secondary dc-to-dc rectification application.