FEATURES
• PROPRIETARY JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE SOFT GLASS
• VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION
  (Solder Voids: Typical < 2%, Max. < 10% of Die Area)
• LOW SWITCHING NOISE
• LOW THERMAL RESISTANCE
• HIGH SWITCHING CAPABILITY
• LOW FORWARD VOLTAGE DROP