FEATURES
 • Plastic MELF package
 • Ideal for automated placement
 • Glass passivated chip junction
 • Available in uni-directional polarity only
 • 400 W peak pulse power capability with a 10/1000 µs waveform, repetitive rate (duty cycle): 0.01 % (200 W above 91 V)
 • Excellent clamping capability
 • Very fast response time
 • Low incremental surge resistance
 • Meets MSL level 1, per J-STD-020, LF maximum peak of 250 °C
 • Solder dip 260 °C, 40 s
 • Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC

TYPICAL APPLICATIONS
    Use in sensitive electronics protection against voltage transients induced by inductive load switching and lighting on ICs, MOSFET, signal lines of sensor units for consumer, computer, industrial and telecommunication.