FEATURES
 • Plastic MINI MELF package.
 • Glass passivated chip junction.
 • 150W peak pulse power capability with a 10/1000µs waveform ,repetition rate(duty cycle): 0.01%.
 • Excellent clamping capability.
 • Very fast response time.
 • Low incremental surge resistance.
 • Typical ID less than 1mA above 10V rating
 • High temperature soldering guaranteed: 250℃/10 seconds of terminal