INTRODUCTION
The manufacturing process of Smartcards involves various components and technologies in order to issue a finished product:
– micromodules,
– flat packages,
– wafers.
■ MICROMODULES
Dedicated package for Smartcard products, the micromodule type depends on the size of the product and on the application.
Table 1 lists all available micromodules.
■ FLAT PACKAGES
For applications which require surface mount technology, suitable for PC cards, or other security modules, STMicroelectronics offers flat packages listed In Table 2.
■ WAFERS
For issuer production need, ST offers sawn and unsawn wafers deliveries, listed in Table 3.