Features:
* Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance.
* Low Surface Mounted Applications
* Low power loss, high efficiency.
* High current capability, low forward voltage drop.
* Guardring for overvoltage protection.
* High Current Capability
* Ultra high-speed switching.
* Silicon epitaxial planar chip, metal silicon junction.
* Lead-free parts meet environmental standards of MIL-STD-19500 /228
* Suffix "-H" indicates Halogen free parts, ex. SL22-M-H.