Features
• Low profile surface mounted application in order to
   optimize board space
• Tiny plastic SMD package
• Low power loss, high efficiency
• High current capability, low forward voltage drop
• High surge capability
• Silicon epitaxial planar chip, metal silicon junction

Mechanical data
• Epoxy : UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-123ST / MINI SMA
• Terminals :Plated terminals, solderable per MIL-STD-750,
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.0155 gram