Available in two types - 0.8mm height without stem or 1.5mm height with stem.
Soldering Conditions
Condition for Reflow
Available for Surface Mount Type.
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple 0.1 to 0.2φCA(K)or CC(T)at solder joints(copper foil surface). A heat resistive tape should be used to fix thermocouple.
3. Temperature profile