Features:
◾ Ultra-low forward voltage
◾ Low leakage current
◾ 30V breakdown voltage
◾ Guard-ring for over-voltage protection
◾ High reliability tested grades & matched
   characteristic options.

Supply Formats:
◾ Default – Die in Waffle Pack (400 per tray capacity)
◾ Sawn Wafer on Tape – By specific request
◾ Unsawn Wafer – By specific request
◾ Die Thickness <> 100µm(4 Mils) – On request
◾ With additional electrical selection – On request