FEATURE
• Ultrafast recovery time for high efficiency
• Low power losses
• Low forward votage drop
• High surge current capability
• Solder dip 260 ºC, 10s
• Component in accordance to RoHS 2011/65/EU and WEEE 2002/96/EC
• Meets MSL level 1, per J-STD-020, LF maximum peak of 260 ºC