FEATURES
• Batch process design, excellent power dissipation offers
   Better reverse leakage current and thermal resistance.
• Guardring for overvoltage protection.
• Very tiny plastic SMD package.
• Super Low Forward Voltage
• Silicon epitaxial planar chip, metal silicon junction.
• Lead-free parts meet environmental standards of
   MIL-STD-19500/228

PACKAGING INFORMATION
• Epoxy: UL94-V0 rated flame retardant
• Case: Molded plastic, SOD323N
• Terminals: Plated terminals,
   solderable per MIL-STD-750, method 2026.