FEATURES
• Glass passivated chip junction
• 500 W peak pulse power capability with a
   10/1000 μs waveform, repetitive rate (duty cycle): 0.01 %
• Excellent clamping capability
• Very fast response time
• Low incremental surge resistance
• Solder dip 275 °C max. 10 s, per JESD 22-B106
• Material categorization: For definitions of compliance
   please see www.vishay.com/doc?99912
  
TYPICAL APPLICATIONS
   Use in sensitive electronics protection against voltage
   transients induced by inductive load switching and lighting
   on ICs, MOSFET, signal lines of sensor units for consumer,
   computer, industrial, and telecommunication.