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S70KL1282GABHI020 데이터시트 - Infineon Technologies

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S70KL1282GABHI020

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Infineon
Infineon Technologies Infineon

128Mb HYPERRAM™ self-refresh DRAM (PSRAM)
HYPERBUS™ interface, 1.8 V/3.0 V


FEATUREs
• Interface
   - HYPERBUS™ interface
   - 1.8 V / 3.0 V interface support
      • Single-ended clock (CK) - 11 bus signals
      • Optional differential clock (CK, CK#) - 12 bus signals
   - Chip select (CS#)
   - 8-bit data bus (DQ[7:0])
   - Hardware reset (RESET#)
   - Bidirectional read-write data strobe (RWDS)
      • Output at the start of all transactions to indicate refresh latency
      • Output during read transactions as read data strobe
      • Input during write transactions as write data mask
   - Optional DDR center-aligned read strobe (DCARS)
      • During read transactions RWDS is offset by a second clock, phase shifted from CK
      • The phase shifted clock is used to move the RWDS transition edge within the read data eye

• Performance, power, and packages
   - 200 MHz maximum clock rate
   - DDR - transfers data on both edges of the clock
   - Data throughput up to 400 MBps (3,200 Mbps)
   - Configurable burst characteristics
      • Linear burst
      • Wrapped burst lengths:
         16 bytes (8 clocks)
         32 bytes (16 clocks)
         64 bytes (32 clocks)
         128 bytes (64 clocks)
      • Hybrid option - one wrapped burst followed by linear burst on 64 Mb. Linear burst across die boundary is not supported.
   - Configurable output drive strength
   - Power modes[1]
      • Hybrid sleep mode
      • Deep power down
   - Array refresh
      • Partial memory array(1/8, 1/4, 1/2, and so on)
      • Full memory array
   - Package
      • 24-ball FBGA
   - Operating temperature range
      • Industrial (I): –40 °C to +85 °C
      • Industrial plus (V): –40 °C to +105 °C
      • Automotive (A), AEC-Q100 grade 3: –40 °C to +85 °C
      • Automotive (B), AEC-Q100 grade 2: –40 °C to +105 °C

• Technology
   - 38-nm DRAM


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