datasheetbank_Logo
전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크
HOME  >>>  Spansion Inc.  >>> S70GL02GP11FFIR12 PDF

S70GL02GP11FFIR12 데이터시트 - Spansion Inc.

S70GL-P image

부품명
S70GL02GP11FFIR12

Other PDF
  no available.

PDF
DOWNLOAD     

page
13 Pages

File Size
360.2 kB

제조사
Spansion
Spansion Inc. Spansion

General Description
The Spansion S70GL02GP 2-Gigabit Mirrorbit Flash memory device is fabricated on 90 nm process technology. This device offers a fast page access time of 25 ns with a corresponding random access time of 110 ns. It features a Write Buffer that allows a maximum of 32 words/64 bytes to be programmed in one operation, resulting in faster effective programming time than standard single byte/word programming algorithms. This makes the device an ideal product for today’s embedded applications that require higher density, better performance and lower power consumption.

Distinctive Characteristics
■ Two 1024 Megabit (S29GL01GP) in a single 64-ball FortifiedBGA package (see publication S29GL-P_00 for full specifications)
■ Single 3V read/program/erase (3.0V - 3.6V)
■ 90 nm MirrorBit process technology
■ 8-word/16-byte page read buffer
■ 32-word/64-byte write buffer reduces overall programming time for multiple-word writes
■ Secured Silicon Sector region
   – 128-word/256-byte sector for permanent, secure identification through an 8-word/16-byte random Electronic Serial Number
   – Can be programmed and locked at the factory or by the customer
■ Uniform 64Kword/128KByte Sector Architecture
   – S70GL02GP: two thousand forty-eight sectors
■ 100,000 erase cycles per sector typical
■ 20-year data retention typical
■ Offered Packages
   – 64-ball Fortified BGA
■ Suspend and Resume commands for Program and Erase operations
■ Write operation status bits indicate program and erase operation completion
■ Unlock Bypass Program command to reduce programming time
■ Support for CFI (Common Flash Interface)
■ Persistent and Password methods of Advanced Sector Protection
■ WP#/ACC input
   – Accelerates programming time (when VACC is applied) for greater throughput during system production
   – Protects first or last sector of each die, regardless of sector protection settings
■ Hardware reset input (RESET#) resets device
■ Ready/Busy# output (RY/BY#) detects program or erase cycle completion

Page Link's: 1  2  3  4  5  6  7  8  9  10  More Pages 

부품명
상세내역
PDF
제조사
1024 Megabit, 3.0 Volt-only Page Mode Flash Memory Featuring 110 nm MirrorBit™ Process Technology ( Rev : 2005 )
Spansion Inc.
1024 Megabit, 3.0 Volt-only Page Mode Flash Memory Featuring 110 nm MirrorBit™ Process Technology
Spansion Inc.
64 Megabit, 32 Megabit 3.0-Volt only Page Mode Flash Memory Featuring 110 nm MirrorBit Process Technology ( Rev : 2007 )
Spansion Inc.
64 Megabit, 32 Megabit 3.0-Volt only Page Mode Flash Memory Featuring 110 nm MirrorBit Process Technology
Spansion Inc.
64 Megabit, 32 Megabit, and 16 Megabit 3.0-Volt only Page Mode Flash Memory featuring 200 nm MirrorBit Process Technology
Spansion Inc.
256 Megabit, 128 Megabit, 64 Megabit, and 32Megabit, 3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology
Spansion Inc.
16 Megabit (2 M x 8-Bit/1 M x 16-Bit) 3.0 Volt-only Boot Sector Flash Memory featuring MirrorBit™ technology
Spansion Inc.
128M-BIT 3.0-VOLT PARALLEL FLASH MEMORY WITH PAGE MODE ( Rev : 2011 )
Winbond
128M-BIT 3.0-VOLT PARALLEL FLASH MEMORY WITH PAGE MODE
Winbond
64M-BIT 3.0-VOLT PARALLEL FLASH MEMORY WITH PAGE MODE
Winbond

Share Link: GO URL

EnglishEnglish Chinese简体中文 Japanese日本語 Russianрусский Spanishespañol

All Rights Reserved© datasheetbank.com  [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]