FEATURES
● FOR SURFACE MOUNTED APPLICATIONS
● LOW PROFILE PACKAGE
● BUILT-IN STRAIN RELIEF
● EASY PICK AND PLACE
● PLASTIC MATERIAL USED CARRIES UNDERWRITERS
   LABORATORY CLASSIFICATION 94 V-0
● FAST SWITCHING
● GLASS PASSIVATED CHIP JUNCTION
● HIGH TEMPERATURE SOLDERING: 250°/10 SECONDS AT
   TERMINALS
● ROHS

MECHANICAL DATA
● CASE: MOLDED PLASTIC, DO-214AC (SMA)
   DIMENSIONS IN INCHES AND (MILLIMETERS)
● TERMINALS: SOLDER PLATED
● POLARITY: INDICATED BY CATHODE BAND
● WEIGHT: 0.064 GRAMS