FEATURES
● Low profile package
● For surface mounted applications
● Built-in strain relief, ideal for automated placement
● Plastic package has underwriters, laborator flammability classification 94V-0
● High temperature soldering: 260°C/10 seconds at terminals

MECHANICAL DATA
● Case :JEDEC SMA, molded plastic over ,passivated chip
● Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
● Weight: 0.002 ounces, 0.064 gram