RGP300 데이터시트 - DIOTEC Electronics Corporation
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RGP300
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DIOTEC Electronics Corporation
FEATURES
● PROPRIETARY SOFT GLASS® JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE
● VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical ≤ 2%, Max. ≤ 10% of Die Area)
● EXTREMELY LOW LEAKAGE AT HIGH TEMPERATURES
● LOW FORWARD VOLTAGE DROP
● 3A at TA= 55 °C WITH NO THERMAL RUNAWAY
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