Features:
• Employing 5th generation planar IGBT chips with 0.6µm design rule or CSTBT™ technology with superior loss performance
• Ultra compact dual or single-in-line transfer mold package (compatible with 2nd generation)
• Including driver and protection circuitry (UV, SC)
• DIP-IPM with reduction of thermal resistance by 20%
• 2500Vrms isolation voltage
• High-active interface logic for direct connection to a 3V or 5V MCU
• Highest reliability and optimised EMI performance
• Available from 3A to 50A / 600V for motor ratings from 0.1kW to 3.7kW
• Optional with open emitter topology for vector control
• All Mitsubishi DIP and Mini-DIP-IPMs have lead-free terminals
• From January 2006 onwards, all DIP and Mini-DIP-IPMs will be supplied with completely lead-free technology