FEATURES
● LOW PROFILE PACKAGE
● PLASTIC PACKAGE HAS UNDERWRITERS LABORATORY 94V-0
● IDEAL FOR SURFACE MOUNTED APPLICATION
● GLASS PASSIVATED CHIP JUNCTION
● BUILT-IN STRAIN RELIEF DESIGN
● ULTRA FAST RECOVERY TIME FOR HIGH EFFICIENT
● HIGH TEMPERATURE SOLDERING : 250 °C/10 SECONDS AT
   TERMINALS
● ROHS

MECHANICAL DATA
● CASE: JEDEC DO-214AA MOLDED PLASTIC BODY, DO-214AA (SMB)
   DIMENSIONS IN INCHES AND (MILLIMETERS)
● TERMINAL: SOLDER PLATED, SOLDERABLE PER MIL-STD-
   750 METHOD 2026
● POLARITY: COLOR BAND DENOTES CATHODE
● WEIGHT: 0.093 GRAMS