General Description
   Micron package-on-package (PoP) products combine NAND Flash and Mobile LPDRAM devices in a single MCP. These products target mobile applications with low-power, high-performance, and minimal package-footprint design requirements. The NAND Flash and Mobile LPDRAM devices are also members of the Micron discrete memory products portfolio.

FEATUREs
• Micron® NAND Flash and Mobile LPDRAM
   components
• RoHS-compliant, “green” package
• Separate NAND Flash and Mobile LPDRAM
   interfaces
• Space-saving package-on-package combination
• Low-voltage operation (1.70–1.95V)
• Industrial temperature range: –40°C to +85°C

NAND Flash-Specific Features
• Organization
   – Page size
      x8: 2112 bytes (2048 + 64 bytes)
      x16: 1056 words (1024 + 32 words)
   – Block size: 64 pages (128K + 4K bytes)

Mobile LPDRAM-Specific Features
• No external voltage reference required
• No minimum clock rate requirement
• 1.8V LVCMOS-compatible inputs
• Programmable burst lengths
• Partial-array self refresh (PASR)
• Deep power-down (DPD) mode
• Selectable output drive strength
• STATUS REGISTER READ (SRR) supported1