FEATURES
•SUGGESTED REPLACEMENT FOR MR2520L, MR2525L, MR2535L
•VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION
 (Solder Voids: Typical < 2%, Max. < 10% of Die Area)
•LARGE DIE FOR HIGH POWER HEAVY DUTY PERFORMANCE
•HIGH HEAT HANDLING CAPABILITY WITH VERY LOW THERMAL STRESS
•PROPRIETARY JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE
•LOW FORWARD VOLTAGE DROP