DESCRIPTION
The MPV series of surface mount Varactor diodes utilizes a unique new monolithic fabrication technology. This technology employs package / device integration accomplished at the wafer fabrication level. Since the cathode and anode interconnections utilize precision photolithographic techniques rather than wire bonds, parasitic package inductance is minimized and tightly controlled.

KEY FEATURES
Tape and Reeled for Automatic Assembly
Low Series Inductance (<0.2nH typical)Low Parasitic Capacitance (0.06 pf typical)
Meets All Commercial Qualification Requirements
0204 Outline
RoHS Compliant

APPLICATIONS/BENEFITS
Low voltage VCOs
Wide bandwidth VCOs
VCXO’s
Linear VCOs
Low noise VCOs
Tunable Filter
Tiny surface mount footprintUltra tight parametric distribution