FEATURES
• Guard -Ring for Stress Protection
• Low Forward Voltage
• Low Power Loss/High Efficiency
• High Surge Capacity
• Low Stored Charge Majority Carrier Conduction
• Pb-Free Packages are Available
• Minimum Lot-to-Lot variations for robust device
   performance and reliable operation

MECHANICAL CHARACTERISTICS
• Case: Epoxy, Molded
• Finish: All External Surfaces Corrosion Resistant and
   Terminal Leads are Readily Solderable
• Lead Temperature for Soldering Purposes: 260℃ Max.
   for 10 Seconds