Features
• package:colored, diffused SOT-23 package
• feature of the device:small package in industry standard 3.0 ×2.6 ×1.1 mm with two chips
• wavelength:628 nm (super-red), 570 nm (green)
• viewing angle:140°
• technology:GaAlP
• optical efficiency:1.5 lm/W (super-red), 2.5 lm/W (green)
• grouping parameter:luminous intensity
• assembly methods:suitable for all SMT assembly methods
• soldering methods:IR reflow soldering
• preconditioning:acc. to JEDEC Level 2
• taping:8-mm tape with 3000/reel, ø180 mm or 12000/reel, ø330 mm

Applications
• optical indicators
• backlighting (LCD, cellular phones, switches, keys, displays, illuminated advertising, general lighting)
• LED chips can be controlled separately