Low Profile Quad Flat Pack (LQFP) Packages:

Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers
to solve issues such as increasing board density, die shrink programs, thin end-product profile and portability.

FEATUREs:
Amkor’s LQFP packaging portfolio provides:
• 7 x 7 mm to 28 x 28 mm body size   
• 32 to 256 lead counts
• Copper leadframes • Broad selection of die pad sizes
• Custom leadframe design available 
• 1.4 mm body thickness
• Low stress die attach adhesive
• Rapid cure mold compound
• Power enhancement version - PowerQuad

Applications:
Amkor’s LQFPs are an ideal IC package for most IC semiconductor technologies such as ASIC, DSP, controllers, processors, gate arrays (FPGA/PLD), SRAMs and PC chip sets.