Features:
• Glass passivated chip
• Reliable low cost construction utilizing molded plastic technique
• Ideal for printed circuit board
• Low forward voltage drop
• Low reverse leakage current
• High surge current capability

Mechanical Data:
• Case: Molded plastic, KBJ
• Epoxy: UL 94V-O rate flame retardant
• Terminals: Leads solderable per MIL-STD-202, method 208 guaranteed
• Mounting position: Any
• Weight: 0.16ounce, 4.6gram