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HDCP03B 데이터시트 - Adam Technologies, Inc.

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HDCP03B

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ADAM-TECH
Adam Technologies, Inc. ADAM-TECH

INTRODUCTION:
Adam Tech Crimp and Poke High Density D-Sub connectors are a popular interface for many I/O applications. Offered in 15, 26, 44, 62 and 78 positions they are a low cost alternative to soldering a high density connector to cable. Contacts are crimped onto discrete wires and pushed into the connector body. The connector is comprised of a metal shell and plastic insulator and is available with a variety of mating options. The contacts are precision stamped and are available in a variety of platings.


FEATURES:
    High Density in standard size shell
    Low cost no solder alternative
    Industry standard compatibility
    Durable metal shell design
    Precision formed contacts
    Variety of Mating and mounting options

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제조사
D-SUBMINIATURE CRIMP AND POKE SYSTEM
Adam Technologies, Inc.
D TYPE CONNECTORS LOW COST HIGH DENSITY CRIMP PIN
Dubilier
High-density Packaging System
HIROSE ELECTRIC
IMAGE AND SIGNAL PROCESSING SUB–SYSTEM
STMicroelectronics
In-System Programmable High Density PLD ( Rev : 2002 )
Lattice Semiconductor
In-System Programmable High Density PLD
Lattice Semiconductor
In-System Programmable High Density PLD ( Rev : 2002 )
Lattice Semiconductor
In-System Programmable High Density PLD
Lattice Semiconductor
In-System Programmable High Density PLD
Lattice Semiconductor
In-System Programmable High Density PLD
Lattice Semiconductor

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