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전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크
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HB28E016BP2 데이터시트 - Hitachi -> Renesas Electronics

HB28E016BP2 image

부품명
HB28E016BP2

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90 Pages

File Size
311.7 kB

제조사
Hitachi
Hitachi -> Renesas Electronics Hitachi

Description
The HB28E016BP2 and HB28D032BP2 are Hitachi Mobile Embedded Flashes with MultiMediaCardTM interface, which are highly integrated flash memories with serial and random access capability.  It is accessible via a dedicated serial interface optimized for fast and reliable data transmission.  This interface allows several cards to be stacked by through connecting their peripheral contacts.  These Hitachi Mobile Embedded Flashes are fully compatible to a new consumer standard, called the MultiMediaCard system standard defined in the MultiMediaCard system specification [1], except the physical outline and the pin assignment.


FEATUREs
• 16 MByte/32 MByte memory capacity
• On card error correction
• MultiMediaCard system standard compatibility
    - System specification version 3.1 compliant
    - SPI mode supports the single and multiple block read and write operations.
    - Block and partial block read supported (Command classes 2)
    - Stream read supported (Command class 1)
    - Block write and erase supported (Command classes 4 and 5)
    - Group write protection (Command classes 6)
    - Stream write supported (Command classes 3)
    - Password data access protection
    - Small erase block size of 512 bytes, tagged erase supported
    - Read block size programmable between 1 and 2048 bytes
    - VCC = 2.7 V to 3.6 V operation voltage range (VCC = 2.0 V to 3.6 V for the interface)
    - No external programming voltage required
    - 4kV ESD protection (Contact Pads)
• High speed serial interface with random access
    - Read speed:   sustained:  13.7 Mbit/s (multi-block read) burst (one block):  20 Mbit/s
    - Write speed:  sustained:  6.4 Mbit/s (multi-block write) burst (one block):  20 Mbit/s
    - Up to 10 stacked card (at 20 MHz, VCC = 2.7 to 3.6V)
    - Access time:  300 µs (typ) (at 20 MHz, VCC = 2.7 to 3.6V)
• Low power dissipation
    - High speed:  216 mW (max) (at 20 MHz, VCC = 3.6 V)
• Compact package for mobile phone and etc.
    - 9 mm × 11 mm × 1.4 mm (max) 71-bump 0.8 mm ball pitch FBGA (BP-71AV)
    - 10 mm × 11 mm × 1.4 mm (max) 71-bump 0.8 mm ball pitch FBGA (BP-71V)

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부품명
상세내역
PDF
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