FEATURES
● PROPRIETARY SOFT GLASS® JUNCTION
   PASSIVATION FOR SUPERIOR RELIABILITY AND
   PERFORMANCE
● VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM 
   MECHANICAL STRENGTH AND HEAT DISSIPATION
   (Solder Voids: Typical ≤ 2%, Max. ≤10% of Die Area)
● EXTREMELY LOW LEAKAGE AT HIGH TEMPERATURES
● LOW FORWARD VOLTAGE DROP
● HIGH CURRENT CAPABILITY