DESCRIPTION
The GC9000 series of spiral bias element chips are photolithographically fabricated planar spiral conductorssupported on a high quality fused quartz substrate. These devices are designed to meet hybrid microwave circuit requirements for DC power injection through Ku (or J) band. The actual spiral bias element, consists of a 5 micron, nominal, thick plated gold spiral trace with a 3 mil diameter bonding pad at either end.