■ Features
● Ultra-thin,thickness (5×3.2×1.2mm).
● It is a compact and thin ceramic package with a matalized lead for surface mounting that is able to be automatically loaded.
● Reflow soldering is possible.
● CMOS, TTL IC direct drive is possible. Depending upon the frequency band, there is also a crystal oscillator with a CMOS-IC with a tri-state function built in.