FEATURES
● GLASS PASSIVATED CHIP JUNCTION
● LOW FORWARD VOLTAGE
● LOW THERMAL RESISTANCE
● HIGH CURRENT CAPABILITY
● HIGH VOLTAGE

MECHANICAL DATA
● CASE: TRANSFER MOLDED
● TERMINAL: MIL-STD-202F METHOD 2026
● POLARITY: AS MARKED
● EPOXY: UL94V-0 FLAME RETARDANT MOLDING COMPOUND
● MOUNTING POSITION: ANY
● WEIGHT: 2.05 GRAMS