DESCRIPTION
The DRS1AF~DRS1MF are available in SMAF package

FEATURES
● For surface mounted applications
● Low profile package
● Glass Passivated Chip Junction
● Easy to pick and place
● Fast reverse recovery time
● Available in SMAF package

MECHANICAL DATA
   Case: SMAF
   Terminals: Solderable per MIL-STD-750,
      Method 2026
   Approx. Weight: 27mg 0.00086oz