Features
• Low power loss, high efficiency.
• High current capability, low forward voltage drop.
• High surge capability.
• Guardring for overvoltage protection.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
• Lead free in compliance with EU RoHS.

Mechanical data
• Epoxy : UL94-V0 rated flame retardant.
• Case : JEDEC TO-247 molded plastic body over
              passivated chip.
• Lead : Axial leads, solderable per MIL-STD-202,
             Method 208 guranteed.
• Weight : Approximated 5.60 gram.