Cree® UltraThin® Gen 3 LEDs

Cree’s UltraThin® LEDs combine highly efficient InGaN materials with Cree’s proprietary G•SiC® substrate to deliver superior price/performance for blue LEDs. These vertically structured LED chips are small in size and require a low forward voltage. Cree’s UT™ series chips are tested for conformity to optical and electrical specifications and the ability to withstand 1000 V ESD. Applications include keypad backlighting where sub-miniaturization and thinner form factors are required.

FEATURES
• Small Chip – 170 x 170 x 50 μm
• Single Wire Bond Structure
• UT LED Performance
   – 450 nm – 12+ mW
   – 460 nm – 12+ mW
   – 470 nm – 10+ mW
   – 527 nm – 4+ mW
• Low Forward Voltage
   – 2.95 V Typical at 5 mA
• Class 2 ESD Rating

APPLICATIONS
• Mobile Phone Keypads
• Audio Product Display Lighting
• Mobile Appliance Keypads
• Automotive Applications