Features:
• Planar Die Construction
• 200mW Power Dissipation
• 2.4-51V Nominal Zener Voltage
• Ideally Suited for Automated Assembly Processes
• In compliance with EU RoHS 2002/95/EC directives
• This is a Pb − Free Device
• All SMC parts are traceable to the wafer lot
• Additional testing can be offered upon request