Device Features and Description
● 25dB Typical Isolation
● 0.4dB Typical Insertion Loss
● Small Size and Low Profile
● MSL 1 moisture rating
● Lead-free/Green/RoHS compliant package
● Application: commercial, space, military wireless system
● Industry Standard SOIC-8 SMT Plastic Package with exposed back side ground pad
● Chip is fully passivated for enhanced performance and reliability
● Can be used without back side ground soldering
   (This may degrade the performance at the high frequency edge. Refer to the following
   typical test data)