Device Features and Description
• 23dB Typical Isolation
• 0.4dB Typical Insertion Loss
• Small Size and Low Profile
• MSL 1 moisture rating
• Lead-free/Green/RoHS compliant package
• Industry Standard SOIC-8 SMT Plastic Package with exposed back side ground pad
• Chip is fully passivated for enhanced performance and reliability
• Can be used without back side ground soldering
   (This may degrade the performance at the high frequency edge. Refer to the following
   typical test data)