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전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크
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AB10S 데이터시트 - Chip Integration Technology Corporation

AB2S image

부품명
AB10S

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4 Pages

File Size
529.9 kB

제조사
CITC
Chip Integration Technology Corporation CITC

■ Features
• Glass passivated die construction.
• Low forward voltage drop.
• High current capability.
• High surge current capability.
• Design for surface mount application.
• Suffix “G” indicates Halogen free parts, ex AB2SG
• Lead free in compliance with EU RoHS.

■ Mechanical data
• Case : SOPA-4,Molded plastic, ABS
• Terminals :plated leads solderable per
                    MIL-STD-202, Method 208
• Polarity : as marked on case
• Mounting position: Any
• Marking: type number


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