Features:
• 125 ℃ TJ operation(VR<5V)
• Unique high power, Half-Pak module
• Optimized for OR-ing applications
• High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance
• Ultra low forward voltage drop
• High frequency operation
• Guard ring for enhanced ruggedness and long term reliability
• This is a Pb − Free Device
• All SMC parts are traceable to the wafer lot
• Additional testing can be offered upon request

APPLICATIONs:
● Parallel switching power supply 
● Free-Wheeling diodes 
● Reverse battery protection
● Redundant power subsystems