1SMB3EZ100 데이터시트 - Transys Electronics Limited
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1SMB3EZ100
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5 Pages
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371 kB
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Transys Electronics Limited
FEATURES
• For surface mounted applications in order to
optimize board space
• Low profile package
• Built-in strain relief
• Glass passivated junction
• Low inductance
• Excellent clamping capability
• Typical ID less than 1 £gA above 11V
• High temperature soldering :
260 ¢J/10 seconds at terminals
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-O
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