Description
In Microsemis Powermite® surface mount package, these zener diodes provide power-handling capabilities found in larger packages. In addition to its size advantages, Powermite® package features include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment.

FEATUREs
· Surface Mount Packaging
· Integral Heat Sink Locking Tabs
· Compatible with automatic insertion equipment
· Full metallic bottom eliminates flux entrapment
· Zener voltage 1.8 to 100V
· Low noise
· Low reverse leakage current
· Tight tolerance available