FEATURES
● Glass passivated chip junction
● Hyperectifier structure for high reliability
● Cavity-free glass-passivated junction
● 1500 W peak pulse power capability with a
10/1000 µs waveform, repetitive rate (duty
cycle): 0.01 %
● Excellent clamping capability
● Very fast response time
● Low incremental surge resistance
● Available in uni-directional and bi-directional
● Solder dip 260ºC, 10s
● AEC-Q101 qualified
● Component in accordance to RoHS 2011/65/EU
and WEEE 2002/96/EC
● Meets MSL level 1, per J-STD-020, LF maximum
peak of 260º C
TYPICAL APPLICATIONS
Used in sensitive electronics protection against voltage
transients induced by inductive load switching and lighting
on ICs, MOSFET, signal lines of sensor units for consumer,
computer, industrial, automotive and telecommunication.