Features:
• Schottky Barrier Chip
• Guard ring Die Construction Forward
Transient Protection
• High Current Capability
• Low Power Loss, High Efficiency
• For Use in Low Voltage, High Frequency
Inverters, Free Wheeling, and Polarity
Protection Applications
• This is a Pb - Free Device
• All SMC parts are traceable to the wafer lot
• Additional testing can be offered upon request
MECHANICAL DATA
• Case: Molded Plastic
• Terminals: Plated Leads Solderable per
MIL-STD-202, Method 208
• Polarity: Cathode Band
• Weight: 0.34 grams (approx.)
• Mounting Position: Any
• Marking: Type Number