FEATURES
For surface mounted applications in order to optimize board space.
Low profile package.
Built-in strain relief.
Glass passivated junction.
Low inductance.
Excellent clamping capability.
Repetition Rate (duty cycle): 0.01%.
Fast response time: typically less than 1.0ps from 0volt to BV min.
Typical IRless than 1µA above 10V.
High Temperature soldering: 260°C/10 seconds at terminals.