BR24G64XXX-5 데이터 시트보기 (PDF) - ROHM Semiconductor

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BR24G64XXX-5

Serial EEPROM Series Standard EEPROM I2C BUS EEPROM (2-Wire)

ROHM Semiconductor 

BR24G64xxx-5 Series

Absolute Maximum Ratings

Parameter

Symbol

Rating

Unit

Remark

Supply Voltage

VCC

-0.3 to +6.5

V Ta=25°C

Input Voltage / Output Voltage

Electro Static Discharge

(Human Body Model)

Maximum Output Low Current

(SDA)

Maximum Junction Temperature

-

-0.3 to VCC+1.0

VESD

IOLMAX

Tjmax

-3000 to +3000

10

150

Ta=25°C.The maximum value of input voltage/

V

output voltage is not over than 6.5V. When the

pulse width is 50ns or less, the minimum value

of input voltage/output voltage is -1.0V.

V Ta=25°C

mA Ta=25°C

°C

Storage Temperature Range

Tstg

-65 to +150

°C

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by

increasing board size and copper area so as not to exceed the maximum junction temperature rating.

Thermal Resistance(Note 4)

Parameter

Symbol

Thermal Resistance (Typ)

1s(Note 6)

2s2p(Note 7)

Unit

SOP8

Junction to Ambient

Junction to Top Characterization Parameter(Note 5)

θJA

197.4

ΨJT

21

109.8

19

°C/W

°C/W

SOP-J8

Junction to Ambient

Junction to Top Characterization Parameter(Note 5)

θJA

149.3

ΨJT

18

76.9

°C/W

11

°C/W

TSSOP-B8

Junction to Ambient

Junction to Top Characterization Parameter(Note 5)

θJA

251.9

ΨJT

31

152.1

20

°C/W

°C/W

MSOP8

Junction to Ambient

θJA

284.1

135.4

°C/W

Junction to Top Characterization Parameter(Note 5)

ΨJT

21

11

°C/W

(Note 4) Based on JESD51-2A(Still-Air)

(Note 5) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside

surface of the component package.

(Note 6) Using a PCB board based on JESD51-3.

Layer Number of

Measurement Board

Material

Board Size

Single

FR-4

114.3mm x 76.2mm x 1.57mmt

Top

Copper Pattern

Footprints and Traces

Thickness

70µm

(Note 7) Using a PCB board based on JESD51-7.

Layer Number of

Measurement Board

Material

4 Layers

FR-4

Top

Copper Pattern

Footprints and Traces

Thickness

70µm

Board Size

114.3mm x 76.2mm x 1.6mmt

2 Internal Layers

Copper Pattern

Thickness

74.2mm x 74.2mm

35µm

Bottom

Copper Pattern

74.2mm x 74.2mm

Thickness

70µm

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TSZ22111 • 15 • 001

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TSZ02201-0GGG0G100910-1-2

05.Jun.2020 Rev.003

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