PI6C184
1122334455667788990011223344556677889900112233445566778899001122112233445566778899001122334455667788990011223344556677889900112211223344556677889900112233445566778899001122334455667788990011221122334455667788P9900r11e22c3344i55s66i77o88n990011122-331445536677C8899l00o1122c11k223344B5566u7788f99f00e11r2233
Output
Buffer
Test
Point
Test Load
3.3V 2.4
Clocking
Interface
1.5
(TTL) 0.4
tSDKP
tSDKH
tSDRISE
tSDFALL
tSDKL
Input
Waveform
1.5V
tplh
Output
Waveform
1.5V
1.5V
tphl
1.5V
Figure 1. Clock Waveforms
Minimum and Maximum Expected Capacitive Loads
Clock
Min. Load Max. Load
Units
Notes
SDRAM
20
30
pF
SDRAM DIMM Specification
Notes:
1. Maximum rise/fall times are guaranteed at maximum specified load.
2. Minimum rise/fall times are guaranteed at minimum specified load.
3. Rise/fall times are specified with pure capacitive load as shown.
Testing is done with an additional 500Ω resistor in parallel.
Design Guidelines to Reduce EMI
1. Place series resistors and CI capacitors as close as possible to the respective clock pins. Typical value
for CI is 10pF. Series resistor value can be increased to reduce EMI provided that the rise and fall time
are still within the specified values.
2. Minimize the number of “vias” of the clock traces.
3. Route clock traces over a continuous ground plane or over a continuous power plane. Avoid routing
clock traces from plane to plane (refer to rule #2).
4. Position clock signals away from signals that go to any cables or any external connectors.
5
PS8320A 10/14/02