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ICS670-02 데이터 시트보기 (PDF) - Integrated Device Technology

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ICS670-02
IDT
Integrated Device Technology IDT
ICS670-02 Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
ICS670-02
LOW PHASE NOISE ZERO DELAY BUFFER AND MULTIPLIER
ZDB AND MULTIPLIER
External Components
The ICS670-02 requires a minimum number of external components for proper operation. Decoupling capacitors of
0.01µF should be connected between VDD and GND on pins 4 and 5, and VDD and GND on pins 13 and 12, as
close to the device as possible. A series termination resistor of 33may be used to each clock output pin to reduce
reflections.
Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the ICS670-02. These ratings, which are
standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these
or any other conditions above those indicated in the operational sections of the specifications is not implied.
Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical
parameters are guaranteed only over the recommended operating temperature range.
Item
Supply Voltage, VDD
All Inputs and Outputs
Ambient Operating Temperature
Storage Temperature
Junction Temperature
Soldering Temperature
Rating
7V
-0.5 V to VDD+0.5 V
0 to +70° C
-65 to +150° C
150° C
260° C
Recommended Operation Conditions
Parameter
Ambient Operating Temperature
Power Supply Voltage (measured in respect to GND)
Min.
0
+3.0
Typ.
Max.
+70
+5.5
Units
°C
V
DC Electrical Characteristics
VDD=3.3 V ±10%, Ambient temperature -40 to +85° C, unless stated otherwise
Parameter
Symbol
Conditions
Min. Typ.
Operating Voltage
VDD
3.0
Input High Voltage
Input Low Voltage
Output High Voltage
Output Low Voltage
Output High Voltage,
CMOS level
VIH
VIL
VOH
VOL
VOH
IOH = -12 mA
IOL = 12 mA
IOH = -4 mA
2
2.4
VDD-0.4
Operating Supply Current
IDD No Load
35
Max.
5.5
0.8
0.4
Units
V
V
V
V
V
V
mA
IDT™ / ICS™ LOW PHASE NOISE ZERO DELAY BUFFER AND MULTIPLIER 3
ICS670-02 REV J 051310

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