NCV8184 데이터 시트보기 (PDF) - ON Semiconductor
부품명
상세내역
일치하는 목록
NCV8184 Datasheet PDF : 20 Pages
| |||
Parameter
DPAK 5−LEAD Package
Junction−to−Board-top (Y−JB, YJB)
Junction−to−Pin 3 (tab) (Y−JL3, YJL3)
Junction−to−Ambient (RqJA, qJA)
Package construction
Without mold compound
NCV8184
PACKAGE THERMAL DATA
Conditions
Typical Value
100 mm2 Spreader Board
645 mm2 Spreader Board
1 oz
2 oz
1 oz
2 oz
18
18
17
16
16
16
16
16
87
77
62
55
Units
°C/W
°C/W
°C/W
Figure 32. PCB Layout and Package Construction for Simulation
http://onsemi.com
14
Share Link: 