NCV8184 데이터 시트보기 (PDF) - ON Semiconductor
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NCV8184 Datasheet PDF : 20 Pages
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NCV8184
2.0 oz Cu
TJ = 25°C
1.0 oz Cu
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COPPER HEAT SPREADER AREA (mm2)
Figure 29. SOIC–8 Exposed Pad, θJA as a Function of
the Pad Copper Area, Board Material FR4
100
50% Duty Cycle
20%
10 10%
5%
2%
1 1%
Single Pulse
(1.0 in pad PCB) Die Size = 2.08 x 1.55 x 0.40 5.0% Active Area
0.1
0.000001 0.00001 0.0001 0.001
0.01
0.1
PULSE TIME (sec)
Notes:
PDM
t1
t2
t1
Duty Cycle, D = t 2
1
10
100
Figure 30. SOIC–8 Exposed Pad Thermal Duty Cycle
Curves on 1.0 in Spreader Test Board, 1.0 oz Cu
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1000
100
10
Cu Area 100 mm2
Cu Area 645 mm2
1
0.1
0.000001 0.00001 0.0001 0.001
0.01
0.1
1
PULSE TIME (sec)
10
100
Figure 31. SOIC–8 Exposed Pad Single Pulse Heating Curve
1000
http://onsemi.com
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